Boron Nitride Saggars [MH-BNC995H - BoronNitride]
Product Features
Introducing our high-performance
Boron Nitride (BN) Products
, designed for high-temperature applications and exceptional durability:
-
High Purity and Density
: Featuring
>99.5% BN purity
and a density of
1.95±0.05 g/cm³
, ensuring superior performance in extreme conditions.
-
Exceptional Thermal Properties
: With a maximum operating temperature of
850°C in air
and
>2000°C in inert atmospheres
, the material is perfect for high-temperature applications.
-
Superior Mechanical Strength
: The flexural strength of
22 MPa
and hardness of
4 kg/mm²
ensure that these products maintain structural integrity under stress.
-
No Binder Additives
: Our process excludes the use of binders, ensuring the stability and purity of the final product.
Applications
Boron Nitride products are ideal for:
-
High-Purity Crucibles
: Suitable for molten metal handling in extreme temperature environments.
-
Crucible and Bearing Plates
: Designed for the sintering of nitride phosphors, silicon nitride, aluminum nitride, and other ceramics and powders.
-
High-Temperature Furnace Components
: Including electrode insulation parts and protective tubes for use in extreme thermal conditions.
-
Boron Nitride Insulation
: Used in polysilicon ingot furnaces for insulation assemblies.
Technical Highlights
-
Cold Isostatic Pressing and Hot Pressing Sintering
: Utilizes advanced two-way pressure sintering technology to create highly dense and durable materials.
-
Low Thermal Expansion
: Coefficient of thermal expansion is controlled between
-1 to 1.2 (10/K)
, ensuring dimensional stability in temperature variations.
-
High Thermal Conductivity
: With thermal conductivity ranging from
50-70 W/mK
, these products efficiently manage heat, ensuring consistent performance in high-temperature environments.
Technical Parameters
|
BN Purity (%)
|
>99.5
|
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Other Components
|
No
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Density (g/cm³)
|
1.95±0.05
|
|
Hardness (kg/mm²)
|
4
|
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Porosity (%)
|
<15
|
|
Flexural Strength (MPa)
|
22
|
|
Coefficient of Thermal Expansion (10/K)
|
-1~1.2
|
|
Thermal Conductivity (W/mK)
|
50-70
|
|
Max. Operating Temperature in Air (°C)
|
850°C
|
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Max. Operating Temperature in Inert Atmosphere (°C)
|
>2000°C
|
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Room Temperature Resistivity (Ω•cm)
|
10¹
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